Sputteranlage / BEOL sputtering tool - PR808444 - 3460 - W

The purpose of this equipment specification is to define basic requirements for a Fully Automatic Cluster for PVD Deposition of barrier layers like Ti(N)/Ta(N)/WTi10(N) and Cu seedlayers as well as new materials used in QC on several different substrate types (Si, Glass with wafer sizes 300mm and 200mm). The tool has to be capable for deposition barrier and seedlayer in high aspect ratio vias (TSVs) Prior to the PVD process, the device wafers are delivered to the cluster in front opening unified pods (FOUPs), which are placed on the respective load ports by the operator. The cluster must be able to fully automatically run the following series of steps: • Unloading designated wafers from the FOUP • upgradable: Wafer ID readout (SEMI std. compatible) • upgradable: Flipping of wafers • Wafer alignment • Defined process steps in UHV with pre-treatment (degassing and cleaning) and deposition • Loading wafers back to origin position into FOUP For high throughput, the machine must be able to run steps in parallel. The programming of recipes must be possible within an appropriate range of options and parameters as required for research and development (R&D).