Scanning Acoustic Microscope (SAM) (IMWS-5.1) - PR875134-2690-P

The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. Fraunhofer IMWS has extensive experience in applying and developing Scanning Acoustic Microscopy (SAM) for failure analysis, particularly in semiconductors for automotive electronics, where precise non-destructive testing is essential. With years of expertise in developing transducers, refining hardware setups, and creating advanced methods for signal processing, Fraunhofer IMWS has continuously pushed the boundaries of SAM technology to improve resolution and sensitivity, especially for 2.5D/3D imaging and modern packaing applications. Currently, a high-resolution GHz-SAM setup is in operation at IMWS, delivering detailed acoustic images at the microscale range. To further enhance these capabilities, the acquisition and integration of a new state-of-the-art Scanning Acoustic Microscopy System are planned. This advanced system will feature enhanced resolution, broader frequency ranges, and improved imaging algorithms tailored for high-precision analysis. The new SAM setup will enable more detailed acoustic imaging, facilitating the detection of subtle defects, delaminations, and structural variances in complex semiconductor packaging. This technology upgrade will be pivotal in addressing the growing demand for advanced failure analysis, supporting innovation in semiconductor manufacturing and packaging solutions.

Options: 1.1.7. General Device Specifications An optional water treatment system should be offered to maintain water quality during operation. 1.2.2. Pulser and Receiver Specifications Optionally, the pulser should allow for customization via an Arbitrary Waveform Generator (AWG). 1.3.5. Operation and Scanning Modes Optionally, the system should allow for the independent movement of the sending and receiving transducers in through-scan mode along the Z-axis to enhance focusing capabilities and adapt to varying sample thicknesses. 1.4.1. "SAM Transducer " Optional Transducer with a center frequency of 30 MHz and focal distance of water of ~12.7 mm (± 1mm) 1.4.2. "SAM Transducer " Optional Transducer with a center frequency of 125 MHz and focal distance of water of ~9 mm (± 1mm) 1.5.2. Additional Features An optional high-speed Z-axis should be offered to provide surface bow compensation and autofocus capabilities. This feature enhances the system's ability to maintain focus on samples with varying topographies or thicknesses during scanning. 1.5.3. Additional Features Optionally, additional pulser can be offered providing excitation pulses in higher frequency range like tone-burst or arbitrary waveform options. 1.6.4. Software and Application Programming Interfaces Optional Support for various programming frameworks and environments is welcome. Please specify any additional support offered. 1.10.2. Other Specifications The supplier optionally offer initial user training (virtual or on-site) for operating the SAM and software tools.