Optical measurement tool - PR887737-2380-P

1 piece Quasi-monolithic integrated (QMI) chiplets combining manifold functions like microprocessors, signal processing high speed interfaces and integrated sensor demand for high quality optical layers. For a quasi-monolithic backend integration of optical chiplets such as photodetectors, lasers, filters, phase shifters or couplers, a large variety of dielectric films (such as SiO2, TiO2, Si3N4 or AlN) is needed to match all requirements of the final system. A precise knowledge of the material parameters like thickness or the complex refractive index over a broad spectral range is essential to tailor the best possible solution for the application. First of all, the measurement of the optical parameters is mandatory to develop the best materials on the new PVD sputtering cluster tool. This is essential to demonstrate the QMI processing line.

The measurement of the optical material parameters shall be done by spectroscopic ellipsometry. The covered wavelength range of the system shall be at least 300 nm - 1700 nm with a spectral resolution below 5 nm. The system has to be capable of handling 200 mm wafers in fully automated mode from cassette to cassette. For the data analysis and the material parameter extraction an offline software is mandatory. This software enables advanced material modelling and easy reprocessing of the measured data. This software must be available for a multi-user license.

The existing equipment at Fraunhofer IMS cannot cover the needed spectral range and resolution. Developing new dielectric materials at the PVD sputtering cluster is not possible without a proper materials characterization at the same site, especially for short development cycles. This new equipment is an essential and strategic extension to enable quasi-monolithic integrated backend-optic, providing optical layers on top of CMOS integrated chiplets which finally will be co-integrated with other chiplets using 2.5 and 3D integration.

Options - Complete system Offline analysis software for the simulation of fit, layer thickness, material constants, refractive index from the exported raw data - Complete system Multi-user license for offline analysis software - Complete system Handling and processing of dual-bonded wafers with a thickness of up to 1500 µm without damaging the wafer or system - Measuring system Spot size smaller than 20µm - Measuring system wavelength range below 350nm - Measuring system wavelength range above 1600nm - Training and support The response time for support and maintenance/repair measures should be less than three working days, as should the delivery of required spare parts. - Training and support Inspection and maintenance at the end of the warranty period (maintenance in the 1st year) - Training and support Main spare parts and consumables for at least one year - Training and support Maintenance contract