3D LIT-OBIRCH system (IMWS-2.1) +Scanning Electron Microscope with ultrafast e-beam operation (IMWS-3.1 ) - PR876527-2690-P

The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. Fraunhofer IMWS has extensive experience in applying and developing non destructive thermal defect localization techniques for failure analysis, particularly in semiconductors for automotive electronics, where precise non-destructive testing is essential. With years of expertise in developing Lock-in Thermography (LIT) methods and creating advanced methods for signal processing, Fraunhofer IMWS has continuously pushed the boundaries of LIT technology to improve resolution and sensitivity, especially for 2.5D/3D imaging and modern packaing applications. To further enhance defect localization capabilities on 3D devices and IC-stacks, the integration of an combined Lock-In Thermography (LIT) and Optical Beam Induced Resistance Change (OBIRCH) measurement system is planned. This enables a precise defect localization of defects with thermal emission and addionally a defect localiaztion of failures with no adequate thermal emission but with electrical sensitivity during an optical excitation. The system should be open for developing of own applications for advanced signal processing of measured values to improve sensitivty and resolution regarding 3D and stacked devices. This tender is for the supply of a combindes LIT and OBIRCH measurements system, including optional features, software support, documentation, delivery, acceptance testing, and warranty.

The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. The e-beam prober system is required for electrical fault isolation of modern integrated circuits (sub 20 nm-nodes) similar to laser based probing techniques utilizing high frequency active voltage contrast detection with nm-resolution. The main application is to probe electrical signals on transistor level and to read out logic states in IC structures and volatile memory arrays to identify functional failures and perform resilience testing of secured IC functions. A complete functional e-beam prober system should be offered including assembly, commissioning and all necessary connections, parts and approvals/certifications for operation. The components and specific requirements are listed below.