200 mm Wafer Prober incl. Temperature Testing - PR874550

1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 300 mm wafers. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetical sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to be made off non-magnetic metarials to prevent distortion while characterizing magnetic field sensors.

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2.1 Installing Conditions AC Voltage (prefered specifications) 230 V 50 Hz, 16 A fuse 3.3 Wafer probing Optional: Wafer thickness 200 µm-1600 µm 3.4 Wafer probing Color camera for wafer alignment Yes 4.2 Wafer Chuck Optional: Minimum temperature -60 °C 5.5 Loading Optional: Wafer ID-Reading for text with standard and non-standard fonts Rating: 100% for YES, 20% for NO 9.1 Electrical Interface and remote control Interface GPIB (IEEE-488) Yes 13.1 Service After expiration of warranty a service contract for at least 3 years Yes