Thermo reflectance microscope (IMWS-01.1) - PR924106-2690-P

1 thermal reflection microscope (IMWS-01.1)

In this context, thermal reflection microscopy represents a powerful technique, as it uses test wavelengths in the optical band to analyze temperature-induced reflection changes on the sample surface. Furthermore, transient laser-based thermal reflection measurements enable the detection and analysis of heat propagation with high resolution, combined with the ability to determine the thermal material properties of the materials involved in bulk materials, especially in thin layers, with local resolution. With the ability to quantitatively estimate thermal properties, Fraunhofer IMWS will contribute to the areas of material classification for technology development and precise, high-resolution failure analysis to uncover the cause of defects. To meet these requirements, the acquisition of a thermal reflection measurement system is planned. This advanced system will enable state-of-the-art time-domain thermal reflectance measurements using a multicolor or heterodyne measurement method. It will also enable precise and quantitative estimation of the thermal material properties of bulk and thin-film materials, as well as analysis of heat propagation and temperature measurements.

This technology extension will be instrumental in meeting the growing demand for advanced failure analysis and supporting innovations in semiconductor manufacturing and packaging solutions.

Options: 1.1.4. General Instrument Specifications: The system should include the following thermal characterization techniques: - The software must enable the quantitative extraction of local thermal properties (e.g., thermal conductivity, diffusion coefficient, interfacial resistance) from measured transients.

1.1.5. General Instrument Specifications: The system should include the following thermal characterization techniques: - Absolute temperature measurements and analysis of transient heat propagation are possible. 1.2.5. Microscope Configuration and Stages: The instrument should include or be mounted on a vibration-isolated platform suitable for high-precision microscopic measurements. 1.3.3. Optical paths and measurement: Pump and probe beams should be arranged so that the probe beam can be shifted relative to the pump beam to enable lateral heat propagation analysis. 1.4.1. Operating and scanning modes "Temperature measurements": The instrument should enable temperature measurements over a wide range. It should therefore have a temperature-controlled sample holder for recording calibration curves that allow a relationship between reflectivity and sample surface temperature. Temperature measurements should be possible with and without the application of a known coating (Al, Mo, Pt, etc.). 1.4.3 Operating and scanning modes The instrument should enable the thermal characterization of layered materials with regard to interfacial resistance/conductance. 1.4.4 Operating and scanning modes The reliably inspectable layer thickness is in the range of 10 nm to 10 µm. 1.4.6 Operating and Scanning Modes The device enables the characterization of thermal properties such as conductance and diffusion coefficient of the individual layer materials of a layered sample by measuring their cross-sectional area. Layer thicknesses can be up to 5 µm. 1.4.11. Operating and Scanning Modes: The device should be optionally prepared for backside measurement. 1.5.4. Additional Features: The system should have a sample tray with three-point leveling. This feature ensures that the samples are correctly aligned and planar to the scan axes. 1.5.7. Additional Features: Suppliers should list and price optional accessories or features that extend the functionality of the thermoreflectance system. 1.6.4. Software and Application Programming Interfaces: Optional support for various programming frameworks and environments is welcome. Please indicate the additional support offered. 1.10.1. Other specifications: Initial user training on performing quantitative and qualitative measurements, as well as on extracting thermal properties, temperature, and heat propagation. 1.10.2. Other specifications: User support via remote communication for 12 months after the device is commissioned.