Thermo reflectance microscope (IMWS-01.1) - PR1017819-2690-P

1 piece Thermoreflectance Microscope

The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" of Fraunhofer IMWS supports partners from industry and academia based on its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. The Failure analysis workflow inherently starts with precise and reliable localization of defect related deviations, necessary for defect localization. With increasing levels of integration functionality and performance increase however, lead to decreasing feature dimensions, extension into the third spatial domain and thus an substantial increase in the overall complexity. Failure localization for high-end microelectronic components and systems are required to provide elevated sensitivity for diverse contrast mechanisms combined with microscopic sensitivity and resolution capabilities. While defects in electronic circuitry can be accompanied by structural alterations and thus be inspected passively, defect-related abnormal emissions open the potential of identification and localization of the failing site or structure. Electrical defects can be accompanied by the emission of photons in a wide spectral band. In that sense thermal emissions hold the highest potential as they have the ability to propagate through opaque materials and allow detection by sufficiently sensitive detection techniques.

1.1.5. General Device Specifications "The system should include the following thermal characterization techniques: - Software must enable quantitative extraction of local thermal properties (e.g., thermal conductivity, diffusivity, interface resistance) from measured transients. " 1.1.6. General Device Specifications "The system should include the following thermal characterization techniques: - Capable of absolute temperature measurements " 1.1.7. General Device Specifications "The system should include the following thermal characterization techniques: - Capable of measurement and analysis of transient heat propagation." 1.2.4. Microscope Configuration and Stages "The motorized stage should provide - incremental trigger upon motion in X. - allow ROI scanning with trigger output for X and Y increments." 1.2.6. Microscope Configuration and Stages The instrument should include or be mounted on a vibration-isolated platform suitable for high-precision microscopic measurements. 1.2.8. Microscope Configuration and Stages The device should optionally allow for the inspection of up to 8 inch wafers. 1.3.3. Optical Paths and Measurement Pump and probe beams should be arranged so the probe spot can be shifted relative to the pump spot, allowing lateral heat propagation analysis. 1.3.6. Optical Paths and Measurement "This microscope should further feature: - a turret possibly accommodating objectives of different magnification" 1.3.8. Optical Paths and Measurement Full-Field Thermoreflectance measurements would be desirable. 1.4.1. Operation and Scanning Modes "Temperature Measurements: The device should allow for temperature measurements in a broad range. It should therefore contain a temperature controllable sample chuck for recording calibration curves that allow relating the reflectivity to the samples surface temperature. Temperature measurements should be possible with and without application of a know coating (Al, Mo, Pt, etc.)" 1.4.3. Operation and Scanning Modes The device should allow for the thermal characterization of layered materials in terms of interface resistivity/conductance 1.4.4. Operation and Scanning Modes Films can be reliably inspected when they have a thickness between 10's of nm and 10's of µm. 1.4.6. Operation and Scanning Modes The device allows characterization of thermal material properties like conductance and diffusivity of laterally narrow structures that have a large thickness. Such a structure can be e.g., the cross sectional face of a stacked-die microelectronic device (e.g., memory stack where the dies have a width of down to approx. 5 µm). 1.5.4. Additional Features The system should include a sample tray that provides three-point leveling. This feature ensures that samples can be properly aligned and planar relative to the scanning axes. 1.6.4. Software and Application Programming Interfaces Optional Support for various programming frameworks and environments is welcome. Please specify any additional support offered. 1.10.1. Other Specifications An initial user training for cunducting the quantitative and qualitative measurements as well as the extraction of thermal properties, temperature and heat propagation. 1.10.2. Other Specifications User support through remote communication for 12 months after commissioning of the device