Precise local milling & polishing System (IMWS-07.1) - PR1068383-2690-P

1 Piece - Precise local milling & polishing System (IMWS-07.1)

The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behaviour, reliability, safety and lifetime of innovative materials in components and systems. The Business Unit "Electronic Materials and Components" Fraunhofer IMWS support industry and research partners by its internationally recognized expertise in failure analyses of electronic components. Fraunhofer IMWS will enhance its capabilities for advanced failure analysis and material characterization to support the ramp up of new heterogenous integration technologies addressing the manufacturing and reliability challenges. To eneable a precise mechanical preparation procedure a specialized depackaging tool is proposed. The system must be a precision grinding 5 axis CNC machine for mechanical preparation of microelectronic devices. The CNC system must be built up as and orthogonal XYZ system with the sample to prepare fixed in in XY-orientation and two additional tilt mechanisms for X- and Y-axis. To estimate the residual thickness of the milled substrate (i.e. Silicon) a second tool for measuring through the substrate is needed. This can be done optically. Because Silicon is only transparent in visible spectrum at a thickness of smaller than 1µm, an optical thickness measuring instrument in the wavelength of Infrared range and in visible range is neccessary.

Options: 1.1.9. General Device Specifications Optional, the systems has to be equipped with an optical non contact measurement system to evaluate the sample orientation by three point alignment in vertical direction and a tilt compensation in both X- and Y-axis so the sample is perfectly perpendicularly oriented to the milling spindle. 1.1.11. General Device Specifications Optional: an additional sample holder must be offered 1.3.4. Spindle Specifications Optional: pneumatic or electric tool changer for fast and toolless change of milling or polishing consumables 1.5.2. Live sample control optional: additonal cameras for live inspection of milling progress 1.8.1. System for collection of dust and particles during milling process "For removal of dust and particles during dry milling processes an vacuum dust collecting system must be offered. It has to be equipped with a HEPA filter system at least of class H13. The system must operate at 230V / 50Hz." 1.8.2. System for collection of dust and particles during milling process For removal of used slurry a recirculating system for supply with fresh water or milling liquid at the milling site must be offered.