MMS-X Molding System (IZM-79) - MMS-X Molding System (IZM-79)

1 unit: MMS-X moulding system

As part of an investment measure, Fraunhofer IZM is procuring a transfer moulding press for encapsulating large-volume electronic components. The system to be procured will expand Fraunhofer IZM's expertise in the field of precision transfer moulding with vacuum support and fully sensor-based process control for encapsulating modules and moulding at panel level. In order to meet the growing demand for the encapsulation of chiplet, MEMS and power component packages under harsh environmental conditions, the moulding press must meet the following criteria: - Large-volume panel-level moulding (at least 100 x 200 x 15 mm³). - Symmetrical (six-sided) and asymmetrical encapsulation (exposure of chip or module surfaces). Large-volume encapsulation with exposure of chip or module surfaces is a key component for the further development of miniaturisation in electronic assemblies, as it enables the realisation of compact, highly integrated and efficient assemblies through appropriate design and the correct selection of encapsulation materials. On-site training for operators is included in the offer.

Optional features:

- Film handling system: underside (LV item - 1.3) - Logging of data (vacuum level, clamping pressure, tool temperature, piston movement) and recipe; after start of curing time (LV item - 4.2) - Integration of temperature/pressure sensors (LV item - 5.10) - Use of the available transport carrier for MMS-i (LV item - 5.14) - Adaptation of the existing tool system for inline viscosity analysis to the moulding press (LV item - 6.2) - Service technician on site within 5 working days (LV item -7.2) - Return of the existing MMS-i (LV item - 7.4)