Laser Plasma Dicer (IZM-25.1) - PR889073-2590-P

1 Laser Plasma Dicer

Heterogeneous integration is based on the electrical interconnection of different types of chiplets fabricated at wafer level. To be able to create such systems individual chips have to be fabricated. Typically the individual chips are diced out of wafers after the processing is done. To be able to cut or to singulate wafers from different materials with a high quality a water assisted laser dicer is necessary. This allows to seperate chips out of a broad spectrum of wafer materials. Even materials which typically create toxic particles (GaAs) when diced exposed to air can be processed due to the dicing sumberged in a fluid. The laser process also allows improved cutting quality compared to the classic approach using blade dicing when used on silicon or glass wafers. Also particle which could adhere to the wafer surface during dicing are directly transported away during cutting by beeing able to cut the wafer while it is under a liquid which transports the debris away and cools the substrate. The device must be able to handle wafers up to 300mm which are mounted on a dicing frame. It must allow seperation of a wide range of semiconductor materials (GaAs, Si, SiC) with a high quality and a low roughness on the cutting edge (Ra<0,3µm).

Optional feature: - Remote access via secure internet connection for fast service support would be advantageous