Increased Throughput Bonder (IZM-02) - PR915564-2590-P

1 piece: Increased throughput bonder with high accuracy (<3µm) is necessary to enable chiplet implementation at 300mm pilot scale. The FC bonder should provide flip chip (face down) and possibly die attach (face up) operations in flexible large scale to cover different assembly aspects / scenarios, from small (passive, low-end SoC) to large chips (high-end SoC) for chiplet integration in multi-chip heterointegration processing (= different chips on the same target die) to produce integrated submodules. For this purpose, the FC bonder should offer the following capabilities: - Flip-chip operation (face-down), possibly also die-attach (face-up) - Placement accuracy of 3 µm for high denisty FP IOs - Throughput of at least 100 UPH in the fully automatic placement cycle with the specified precision - Substrate chuck for up to 300mm and the option of using special adapters (up to 20mm thick) for multi-single-diced substrates - Feeding of source chips in wafer form (source wafer diced on tape, FFC, Hoopring, up to 300mm), in trays/waffle packs and gel packs (2' and 4') to ensure heterointgeration. - Source chip size of at least 500 µm to 20 mm (edge length), possibly also smaller and larger - Must be able to process source die thicknesses of up to 50 µm, possibly up to 20 µm - Possibly multi-chip processing, i.e. placement of several and different chips on one and the same target die (multichip / heterointegration), possibly with multiple tools (i.e. possibly support of wafer mapping of source and target and traceability of the chip (source-target) - possibly chip-to-substrate levelling for precision of HD FP large chips - Placement force range of at least 50 g (small chips, few IOs) and up to 2 kg (large chips with high IO density), possibly lower force and higher forces - Chip (head) and substrate (chuck) heating for temperature processes, possibly up to 300°C - remote control and routine for operator calibration/verification of accuracy is preferred - possibly flux unit for source die immersion and liquid dispensing is 'nice-to-have’ - possibly pre-inspection and inspection after bonding/placement to verify process accuracy (integrated/in-line or outside bonder) for throughput stability - possibly bonder with integrated microenvironment.

Options: - Pick&Place @ 150°C , throughput >100 UPH - It is possible to equip the device with an ioniser if an electrostatic chip is attached to the arm / is being handled - Possibility of equipping the device with an ioniser, to avoid electrostatic charging of the substrate - Plasma pre-treatment of the bond surface of the chip-bond side before bonding - Plasma pre-treatment of the bond position - Downlooking@ onto the chip in the intermediate station (for die attach mode) - Ability to equip the device with selectable chuck areas (i.e. smaller zones than the entire bond area). (i.e. smaller zones than the entire chuck) for individual substrates, e.g. at least one centre vacuum - 6 mm (for the use of existing proprietary floor adapters for chip-by-chip modules in the pick-and-place process on the substrate chuck) - Possibility of integrating laser soldering into the system - System for limiting the entry of particles from the environment into the interior of the machine, e.g. with an FFU integrated into the device with an FFU integrated into the device - Total consumption of the machine N2 below 100L/min - Data logging (storage and retrieval of monitored process parameters), especially for process setups - If an electrical transformer is required, it should be supplied with the device - If an electrical transformer is required, it should be possible to place it outside the cleanroom (e.g. on a cleanroom plenum)