ICP Trockenätzanlage Chlor IV (IAF-07b1) - PR1119209-2050-P

1 piece Chlorine ICP

Chlorine ICP etching system with planar plasma source The etching processes developed and qualified at the IAF for structuring must be directly reusable on the new system and deliver corresponding etching results, as with the etching system currently in use (Sentech ICP-RIE SI500 537). These known processes should be transferable to wafer sizes of 150 mm.

Options: Substrate electrode Option to etch wafers with a diameter of 100 mm (flat) and fragments on metal carriers.

Substrate electrode Option to etch 75 mm diameter wafers (flat) and fragments on metal carriers.

Process chamber Heated liner

Service Extended warranty

Spare parts kit Gas ring Spare parts kit MVV measuring tube Spare parts kit Silencer and protective cover for lock pump Spare parts kit Turbo pump for lock Spare parts kit Coupling plate without window Spare parts kit Clamping for 150 mm wafers with notch Spare parts kit Julabo recirculating cooler as replacement Spare parts kit PLC control unit (CPU / RFC)

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