i-line-Stepper-Belichtungssystem (IISB.WP4.5) - PR840232-2790-P

1 piece i-line stepper exposure system

A stand-alone i-line stepper exposure system is sought. This is used for structure transfer by selective exposure of UV light-sensitive photoresist systems through a reducing photomask. The UV radiation is to be generated by a mercury vapor lamp or an LED light source.

Options: 2.7 Option of front-to-backside adjustment. Please specify the achievable overlay accuracy between the front and backside plane, as well as information on the substrate conditions that enable or restrict the front-to-backside adjustment (e.g., material, wafer thickness, etc.) 2.9 LED as light source or retrofitting the mercury arc lamp source to an LED light source within 10 years after delivery. 3.3 Processing of 100 mm substrates with substrate characteristics listed in 3.3.1 - 3.3.x. The evaluation of the following points is based on the effort required to convert 150 & 200 mm processing ("standard material") to 100 mm wafer processing. The shorter the conversion times, the better. Please provide information on the average duration and effort for conversion. 3.3.1 Automatic handling (including loading and unloading process), alignment (including "Flat Align": Automatic loading with pre-alignment of the wafers and flat alignment 3σ ≤ 10 µm) and processing (first exposure and exposure with prior alignment) for 100 mm substrates with substrate thicknesses of 200 - 1650 µm (± 25 µm) of transparent, semi-transparent, or opaque materials such as glass, silicon carbide, and silicon. 3.3.2 Handling and processing of substrate materials not explicitly listed in points 3.1 - 3.3.1 (e.g., glass, GaN, Ge) with substrate sizes and thicknesses, as well as warpage according to specifications set in 3.1 - 3.3.1, including automatic loading with pre-alignment of the wafers and flat alignment 3σ ≤ 10 µm. The more substrate variations that can be processed, the better. Please provide information on the conditions under which these substrates can be reliably processed. 3.3.3 Handling and processing of substrates not explicitly listed in points 3.1 - 3.3.2 (e.g., 125 mm wafers, wafer fragments, rectangular substrates, etc.), including automatic loading with pre-alignment of the wafers and flat alignment 3σ ≤ 10 µm. Evaluation is based on effort and duration of the conversion process; the shorter/lower, the better. Please describe the necessary work and the average conversion duration, and under which conditions these substrates can be reliably processed (e.g., with a carrier system). 3. "Compatibility of the handling system with the following cassette models: 100 mm substrates: Type number A72-39M-06, Material: Fluoroware PFA" 6.1.1 GEM300 connection 6.2.3 Computer shall be integrable into the existing Windows AD domain 6.2.4 Remote access for monitoring and remote control of the system 6.2.6 Offline version of the software for preparing exposure jobs