Contactless Coating on Panel Level (IZM-73.1) - PR1104322-2590-P

1x Contactless coating on panel level

As part of an investment measure, Fraunhofer IZM is procuring a dispensing platform for the contactless application of encapsulation materials and adhesives in the µm range. Adhesives are to be processed on large-area substrates using jet and dispensing technology. This system will be used to apply minute amounts of adhesive for 3D contacting in the micrometre range, for die attach technology, flip chip underfill, the construction/realisation of 3D structures and the passivation of components using contactless jetting processes. The contactless application of material makes the system particularly suitable for the construction of chiplets with complex 3D topography. A wide range of materials with low, medium and high viscosity in the range from 0.01 Pa s to 2000 Pa s can be used as adhesives or encapsulation materials, primarily highly filled epoxies, but also cyanates, urethanes and silicones.

Optional features:

- Fluxer with variable dip bed (LV-Pos - 1.13) - Interfaces for logging process data (LV-Pos - 1.22) - Preflow eco-PEN XS 180 dosing device from Viscotec (LV-Pos - 1.29) - Process camera (LV-Pos - 1.35) - SWIR camera for inspections (LV-Pos - 1.36)