CD-SEM Measurement System (IPMS-MRS03.1) - PR884397-2480-P

1 CD-SEM Measurement System

Requirements for top-down measurement of critical dimensions of lines/spaces, holes/columns and other fine features, such as elongated hile/pillar patterns formed on semiconductor wafers during wafer fabrication, using a high-throughput CD-SEM. The system is used for processing MEMS wafers in a CMOS-compatible clean-roam class 10 (approx. ISO 4) production environment.

Optional service items: 1.15 General requirements The system is equipped with an uninterruptible power supply (UPS). Yes 3.3 Measurement system The traceable certified standard is part of the delivery. The calibrations are not older than 20% of the recommended calibration interval at the time of delivery. Note: A traceable certified standard can be provided by the supplier. Otherwise, Fraunhofer IPMS will provide a VLSI-certified standard. Yes 4.16 Process The system is capable of performing 3D measurements using a tilted beam. Yes 4.17 Process The system can detect and visualize backscattered electrons (BSE). It is possible to perform CD measurements on the BSE image. Yes 8.2 Optional tool features Please provide an offer for a set of consumables (lamps, O-rings, valves, etc.). Yes 8.4 Optional tool features Please provide a separate offer for typical spare parts such as axis encoder, laser interferometer, etc. Yes 11.4 Extended Warranty Should offered extended warranty starting from the date on which the statutory warranty expires. An extended warranty of further 12 months should be offered. During the warranty period all support, repair and parts cost should be covered. 12 months