Analytic-Prober (IPMS-MRS11.4)Analytic-Prober (IPMS-MRS11.4) - PR863933-2480-P

1 piece Analytic-Prober

Automated wafer prober to be used for electro-optical test. This "Analytic Prober" will be used for contacting (probing) MEMS and OLED semiconductor wafers and bare dies (e.g. QMI - chiplets) in a CMOS compatible cleanroom according to class 4 EN ISO 14644-1 production environment. It must offer enough free space above the contacted DUT to place there several optical measuring devices precisely and permanently.

Optional service items: 1.5 General Tool Description Appropriate measures have been taken to prevent electrostatic charging of the DUTs. YES 2.1.3 Wafer Chuck Exchangeable surface addon YES 2.1.17 Wafer Chuck Optionally: electrical discharge of the chuck: A device that temporarily discharges the chuck automatically before & during wafer loading YES 2.1.27 Wafer Chuck Optionally: For X-Y-Theta alignment alternative (additional) user-defined targets are possible, in case of first target is missing on DUT. YES 2.2.15 Probing, Probe Card, Probe Cleaning Optionally: automatical probe mark inspection - using the the above mentioned top-down camera on the currently loaded DUT YES 2.3.1.3 automatically loaded 200mm wafers Optionally: 200mm wafers can have a notch at a transparent wafer edge (e.g. a diameter-reduced CMOS wafer is bonded onto a 200mm glass wafer with a notch at the glass edge). Please refer to figure 6. YES 2.3.1.7 automatically loaded 200mm wafers "Optionally: extended min. possible thickness for automatically loaded 200mm wafers is ≤ 400µm " YES 2.3.1.8 automatically loaded 200mm wafers "Optionally: extended max. possible thickness for automatically loaded 200mm wafers is ≥2000µm " YES 2.3.2.1 automatically loaded 300mm wafers Optionally: 300mm FOSB (front opening shipping box) can be handled YES 2.3.2.2 automatically loaded 300mm wafers Optionally: 300mm FOUP (front opening unified pod) can be handled YES 2.3.2.8 automatically loaded 300mm wafers Optionally: extended min. possible thickness for automatically loaded 300mm wafers is ≤ 400µm YES 2.3.2.9 automatically loaded 300mm wafers Optionally: extended max. possible thickness for automatically loaded 300mm wafers is ≥ 2000µm YES 2.4.4.4 manually loaded pocket wafer Optionally: The single dies assembled on the pocket wafer will be automatically X/Y/Theta-aligned and Z-profiled referring to probes (Chip-Alignment). The chips are arranged in a fixed X/Y grid (tolerance ca. ±100µm) with same Z-Height. This grid is configured to ensure that each chip is serviced by at least one vacuum hole. In terms of chip alignment this setup is similarly to a diced wafer on a sawing frame. YES 7.1 Extended Warranty An extended warranty of further 24 months should be offered. During the warranty period all support, repair and parts cost should be covered. Yes